Frequently Asked Questions
It is the highly controlled removal of oils, particles, flux residues, machining fluids, and other contaminants from components and assemblies where surface cleanliness directly impacts subsequent processing, electrical performance, or long-term product reliability.
Compatibility relies on the specific fluid formulation and the component materials. All cleaning processes should be validated against the specific metals, plastics, elastomers, coatings, and adhesives present in your assembly.
Yes. Selected solvents are highly effective for PCB and electronic assembly cleaning, particularly in applications demanding low residue, rapid evaporation, strict material compatibility, and highly controlled performance.
Many feature high volatility for rapid evaporation. Actual drying times are dictated by the fluid's boiling point, component geometry, fluid temperature, ambient airflow, equipment design, and total solvent loading.
